Jove
Visualize
Contact Us
JoVE
x logofacebook logolinkedin logoyoutube logo
ABOUT JoVE
OverviewLeadershipBlogJoVE Help Center
AUTHORS
Publishing ProcessEditorial BoardScope & PoliciesPeer ReviewFAQSubmit
LIBRARIANS
TestimonialsSubscriptionsAccessResourcesLibrary Advisory BoardFAQ
RESEARCH
JoVE JournalMethods CollectionsJoVE Encyclopedia of ExperimentsArchive
EDUCATION
JoVE CoreJoVE BusinessJoVE Science EducationJoVE Lab ManualFaculty Resource CenterFaculty Site
Terms & Conditions of Use
Privacy Policy
Policies

Related Experiment Video

Updated: Aug 10, 2025

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies
08:21

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies

Published on: March 20, 2015

12.5K

High density vertical optical interconnects for passive assembly.

Drew Weninger, Samuel Serna, Achint Jain

    Optics Express
    |February 14, 2023
    PubMed
    Summary

    Novel optical couplers enable higher bandwidth in co-packaged optics. This technology is crucial for scaling beyond 50 Tbps top-of-rack switches by facilitating dense, vertical stacking of optical transceivers (TxRx).

    Related Concept Videos

    You might also read

    Related Articles

    Articles linked to this work by shared authors, journal, and citation graph.

    Sort by
    Same author

    Correlation of right ventricular volumes and ejection fraction by 3D echo and cardiac MRI in postoperative tetralogy of Fallot patients with free pulmonary valve regurgitation.

    Indian heart journal·2026
    Same author

    Advances in waveguide to waveguide couplers for 3D integrated photonic packaging.

    Light, science & applications·2025
    Same author

    Crown ether decorated silicon photonics for safeguarding against lead poisoning.

    Nature communications·2024
    Same author

    When Two Worlds Collide: A Rare Case of Multiple Myeloma With Extramedullary Plasmacytoma.

    Cureus·2024
    Same author

    When Sight and Cancer Collide: A Rare Case of Paraneoplastic Bilateral Optic Neuritis.

    Cureus·2024
    Same author

    pyCapsid: identifying dominant dynamics and quasi-rigid mechanical units in protein shells.

    Bioinformatics (Oxford, England)·2023

    Area of Science:

    • Photonics and Optical Engineering
    • Integrated Optics
    • Semiconductor Device Technology

    Background:

    • Co-packaging of optics and electronics is key for next-generation data center switches exceeding 50 Tbps.
    • Scaling bandwidth, cost, and energy efficiency in co-packaged designs depends on optical transceiver (TxRx) density, not just transistor scaling.
    • Vertical stacking of optical TxRx chips is necessary due to the larger footprint of optical components.

    Purpose of the Study:

    • To propose and simulate a novel chip-to-chip optical coupler for dense, vertical integration in co-packaged optics.
    • To enable efficient, high-bandwidth optical connections between silicon nitride and silicon on insulator waveguides.

    Main Methods:

    • Proposed a novel coupler scheme using overlapping, inverse double tapers for vertical coupling.

    More Related Videos

    High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods
    07:51

    High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods

    Published on: December 23, 2013

    7.5K
    Quasi-light Storage for Optical Data Packets
    07:45

    Quasi-light Storage for Optical Data Packets

    Published on: February 6, 2014

    10.9K

    Related Experiment Videos

    Last Updated: Aug 10, 2025

    Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies
    08:21

    Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies

    Published on: March 20, 2015

    12.5K
    High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods
    07:51

    High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods

    Published on: December 23, 2013

    7.5K
    Quasi-light Storage for Optical Data Packets
    07:45

    Quasi-light Storage for Optical Data Packets

    Published on: February 6, 2014

    10.9K
  • Utilized Lumerical's 3D Finite Difference Time Domain (FDTD) solver for detailed optical simulations.
  • Investigated performance metrics including insertion loss, alignment tolerances, bandwidth, and angular tolerances.

    • Main Results:

    • Achieved insertion losses below -0.13 dB with a 1 µm inter-chip spacing.
    • Demonstrated significant alignment tolerances: ~2.6 µm vertically and ±2.8 µm laterally.
    • Obtained a 1 dB bandwidth exceeding 300 nm and angular tolerances of ±2.3 degrees (twist) and 0.4 degrees (tilt).

    Conclusions:

    • The proposed coupler is a viable enabling technology for high-performance, high-density co-packaged optical designs.
    • Demonstrated CMOS-compatible, out-of-plane optical connections suitable for scaling optical transceivers (TxRx).
    • The coupler's wide tolerances and low loss support practical implementation in future switch architectures.