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Fabrication of Schottky Diodes on Zn-polar BeMgZnO/ZnO Heterostructure Grown by Plasma-assisted Molecular Beam Epitaxy
Published on: October 23, 2018
Soft Ionic Diode Fabricated Using Asymmetric Ion Distribution in Li+-Zn(II)/Cu(II) Metallohydrogels
Yeeshu Kumar1, Mrigendra Dubey1
1Soft Materials Research Laboratory, Department of Metallurgy Engineering and Materials Science, Indian Institute of Technology Indore, Indore 453552, India.
Abstract:
The development of metal ions-incorporated soft materials is of great importance in the present scenario due to their essential requirement in the fabrication of the components such as ionic diodes and electrochemical transistors for soft electronic devices. In the current work, to fabricate a soft ionic diode, two distinct Li+-driven conductive metallohydrogels, namely, MG-Zn and MG-Cu, have been obtained by individually treating a LiOH deprotonated pregelator (H) with Zn(OAc)2 or Cu(OAc)2. The pregelator and metallohydrogels have been well characterized by using various instrumental techniques, which supports their proposed formulations. Field emission scanning electron microscopic images of metallohydrogels reveal the presence of a fibrous network, which helps to create a gel matrix, whereas the rheological experimental results ascertain the true gel phase nature of the synthesized metallohydrogels. The obtained MG-Zn and MG-Cu metallohydrogels were subjected to electrochemical impedance spectroscopic and band gap measurements. The MG-Zn and MG-Cu showed ionic conductivities of 1.02 × 10-3 and 1.14 × 10-3 S/cm, along with band gaps of 2.82 and 2.85 eV, respectively, thus claiming their suitability for device fabrication. Further, the fabricated metallohydrogel-based ionic diode shows appreciable ability to rectify the ionic current with the forward and reverse bias currents of 19 and 1.9 mA at +/-4 V bias potential. Based on all the experimental results, the mechanism has been well established for the rectification behavior in the fabricated metallohydrogel ionic diode.

