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Biasing metal-semiconductor junctions involves applying a voltage across the junction. Specifically, the metal is connected to a voltage source, while the semiconductor is grounded. This technique is essential for controlling the direction and magnitude of current flow in electronic devices, including diodes, transistors, and photovoltaic cells.
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Understanding the behavior of diodes when forward-biased is a fundamental aspect of electronic circuit design and analysis. This analysis primarily utilizes two models: the exponential diode model and the constant-voltage-drop model. The exponential model comes into play when the source voltage exceeds 0.5 volts, pushing the diode current to rise exponentially above the saturation current. This relationship is graphically depicted in the current-voltage (I-V) curve, illustrating the diode's...
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In electronic circuits, reverse-biased diode configurations are critical for regulating voltage levels. Zener diodes exploit the reverse breakdown phenomenon and exhibit a controlled breakdown at a specific Zener voltage (VZ). They are designed to maintain a constant voltage across their terminals and are commonly used for voltage regulation in circuits.
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The operation of a p-n junction diode involves various biasing conditions, including forward bias, reverse bias, and equilibrium.
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Related Experiment Video

Updated: Aug 8, 2025

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Modeling the Effects of Threading Dislocations on Current in AlGaN/GaN HEMT.

Censong Liu1, Jie Wang1, Zhanfei Chen1

  • 1Zhejiang Key Laboratory of Large-Scale Integrated Circuit Design, Hangzhou Dianzi University, Hangzhou 310018, China.

Micromachines
|February 25, 2023
PubMed
Summary

Threading dislocations in AlGaN/GaN high electron mobility transistors (HEMTs) impact device performance by increasing trap filling. This study models reduced drain current and increased gate leakage due to these dislocations.

Keywords:
AlGaN/GaN HEMTscurrent collapsegate leakage currentmodelingthreading dislocations

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Area of Science:

  • Materials Science
  • Semiconductor Physics
  • Device Engineering

Background:

  • Threading dislocations in AlGaN/GaN heterostructures are known to degrade device performance.
  • These defects act as charge traps, influencing carrier transport and leakage currents.
  • Understanding and modeling these effects are crucial for optimizing HEMTs.

Purpose of the Study:

  • To develop a comprehensive model for the effects of threading dislocations on gate and drain currents in AlGaN/GaN HEMTs.
  • To accurately capture the charge trapping/detrapping phenomena caused by dislocations.
  • To precisely describe the reverse gate leakage current, particularly the Poole-Frenkel effect.

Main Methods:

  • Modeling drain current drop using two simplified RC subcircuits with diodes to simulate trapping/detrapping.
  • Incorporating trap voltages from RC networks into the drain current model.
  • Developing a novel Poole-Frenkel (PF) model for reverse gate leakage current, considering acceptor-decorated dislocations.
  • Implementing the physical parameter-based model in Verilog-A.

Main Results:

  • The proposed model accurately predicts the decrease in drain current due to increased trap filling with threading dislocations.
  • The model successfully captures the increase in gate leakage current, dominated by the Poole-Frenkel effect.
  • The Verilog-A implementation shows excellent agreement with experimental data.

Conclusions:

  • The developed model provides a physically accurate representation of threading dislocation effects on AlGaN/GaN HEMT electrical characteristics.
  • This work offers a valuable tool for device simulation and optimization, enabling improved HEMT design.
  • The accurate modeling of gate leakage and drain current degradation is essential for reliable high-power electronics.