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Modeling the Effects of Threading Dislocations on Current in AlGaN/GaN HEMT
Censong Liu1, Jie Wang1, Zhanfei Chen1
1Zhejiang Key Laboratory of Large-Scale Integrated Circuit Design, Hangzhou Dianzi University, Hangzhou 310018, China.
Threading dislocations in AlGaN/GaN high electron mobility transistors (HEMTs) impact device performance by increasing trap filling. This study models reduced drain current and increased gate leakage due to these dislocations.
Area of Science:
- Materials Science
- Semiconductor Physics
- Device Engineering
Background:
- Threading dislocations in AlGaN/GaN heterostructures are known to degrade device performance.
- These defects act as charge traps, influencing carrier transport and leakage currents.
- Understanding and modeling these effects are crucial for optimizing HEMTs.
Purpose of the Study:
- To develop a comprehensive model for the effects of threading dislocations on gate and drain currents in AlGaN/GaN HEMTs.
- To accurately capture the charge trapping/detrapping phenomena caused by dislocations.
- To precisely describe the reverse gate leakage current, particularly the Poole-Frenkel effect.
Main Methods:
- Modeling drain current drop using two simplified RC subcircuits with diodes to simulate trapping/detrapping.
- Incorporating trap voltages from RC networks into the drain current model.
- Developing a novel Poole-Frenkel (PF) model for reverse gate leakage current, considering acceptor-decorated dislocations.
- Implementing the physical parameter-based model in Verilog-A.
Main Results:
- The proposed model accurately predicts the decrease in drain current due to increased trap filling with threading dislocations.
- The model successfully captures the increase in gate leakage current, dominated by the Poole-Frenkel effect.
- The Verilog-A implementation shows excellent agreement with experimental data.
Conclusions:
- The developed model provides a physically accurate representation of threading dislocation effects on AlGaN/GaN HEMT electrical characteristics.
- This work offers a valuable tool for device simulation and optimization, enabling improved HEMT design.
- The accurate modeling of gate leakage and drain current degradation is essential for reliable high-power electronics.
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