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Research Progress on Bonding Wire for Microelectronic Packaging.

Hongliang Zhou1, Yingchong Zhang1, Jun Cao1

  • 1School of Mechanical and Power Engineering, Henan Polytechnic University, Jiaozuo 454000, China.

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|February 25, 2023
PubMed
Summary
This summary is machine-generated.

The rising cost of gold (Au) bonding wire drives the search for alternatives like copper (Cu) and silver (Ag) in microelectronic packaging. While Cu and Ag offer benefits, Ag bonding wire emerges as a promising alternative due to its balanced properties.

Keywords:
bonding wiredevelopment trendsgeneral comparisonmanufacturabilityreliability

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Area of Science:

  • Materials Science
  • Electrical Engineering
  • Semiconductor Manufacturing

Background:

  • Wire bonding remains the dominant chip interconnect technology in microelectronic packaging.
  • Gold (Au) bonding wire has been a long-standing industry standard due to its stability and reliability.
  • Increasing Au prices necessitate exploration of alternative bonding materials like copper (Cu) and silver (Ag).

Purpose of the Study:

  • To review the historical development of bonding wires.
  • To compare the manufacturability and reliability of Au, Cu, and Ag bonding wires.
  • To analyze the performance and applications of these bonding wire materials.

Main Methods:

  • Literature review of bonding wire technology and applications.
  • Comparative analysis of material properties (cost, conductivity, hardness, reactivity).
  • Discussion of manufacturing processes and reliability under various conditions.

Main Results:

  • Cu bonding wire offers lower cost and higher conductivity than Au but presents challenges with hardness and oxidation.
  • Ag bonding wire shows potential with high thermal conductivity, low resistivity, and a more manageable bonding process compared to Cu.
  • Each material (Au, Cu, Ag) has distinct advantages and disadvantages influencing their suitability for specific microelectronic packaging applications.

Conclusions:

  • Silver (Ag) bonding wire presents a compelling alternative to traditional gold (Au) and copper (Cu) bonding wires.
  • The selection of bonding wire material depends on a trade-off between cost, performance requirements, and process complexity.
  • Future trends in wire bonding technology are influenced by material innovation and cost-effectiveness.