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Published on: February 12, 2017
Development of controlled nanosphere lithography technology
Artem A Osipov1,2, Alina E Gagaeva3, Anastasiya B Speshilova1
1Peter the Great St. Petersburg Polytechnic University, St. Petersburg, 195251, Russian Federation.
This study optimizes nanosphere lithography (NSL) for creating nanostructures. Key parameters for spin-coating and plasma etching were identified to achieve high-coverage nanosphere masks and controllable nanoneedle fabrication.
Area of Science:
- Materials Science
- Nanotechnology
- Surface Science
Background:
- Nanosphere lithography (NSL) is a cost-effective technique for fabricating nanostructures.
- Spin-coating is a promising method for creating nanosphere masks, but requires optimization.
- Controlling nanosphere size is crucial for various nanoelectronic and optoelectronic applications.
Purpose of the Study:
- To investigate the influence of spin-coating parameters on nanosphere mask formation.
- To study the controllable size reduction of nanospheres using plasma etching.
- To optimize NSL for high-coverage and reproducible fabrication of nanostructures.
Main Methods:
- Spin-coating of 300 nm nanospheres on a substrate.
- Inductively coupled plasma etching for nanosphere size reduction.
- Analysis of technological parameters affecting coverage and etching rates.
Main Results:
- Optimized spin-coating parameters (speed, time, solution composition) increased substrate coverage to 97.8%.
- Plasma etching parameters (high-frequency power) precisely controlled nanosphere diameter reduction.
- Process reproducibility reached 98.6%, enabling nanoneedle fabrication.
Conclusions:
- Optimized NSL parameters enable efficient and reproducible fabrication of nanosphere masks.
- Plasma etching provides accurate control over nanosphere size reduction for nanoneedle applications.
- The developed NSL process is suitable for nanoelectronics, optoelectronics, and field emission cathodes.
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