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Development of an Electrically Conductive MDF Panel-Evaluation of Carbon Content and Resin Type
Christof Tschannen1, Ali Shalbafan2, Heiko Thoemen1
1Institute for Materials and Wood Technology, Bern University of Applied Sciences (BFH), CH-2500 Biel, Switzerland.
Abstract:
Electronics in furniture and construction materials, in particular technologies which allow for a flexible and cable-free connection of electronics in such materials, are gaining broader interest. This study shows a further development of a concept to obtain highly conductive medium-density fibreboard panels (MDF) for furniture application. MDF were produced using two mixing processes (wet and dry) for wood and carbon fibres to investigate the effects of resin type (urea formaldehyde (UF) and polymeric methylene diphenyl diisocyanate (pMDI)) and carbon fibre content on their mechanical, physical, and electrical properties. Overall, wet mixed fibres showed better electrical but reduced mechanical properties. Modulus of elasticity (MOE) and bending strength (MOR) values of 3500 MPa and 35 MPa, respectively, and internal bond (IB) values of 0.45 to 0.65 MPa with electrical conductivities of up to 230 S/m were achieved. The technology has been successfully implemented in a demonstration object showing the application in a small piece of furniture.
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