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Low-Temperature Curable Negative-Tone Photosensitive Polyimides: Structure and Properties.

Sheng-Nan Fan1,2, Li-Li Yuan1, Li-Zhe Wang1

  • 1Key Laboratory of Science and Technology on High-tech Polymer Materials, Institute of Chemistry, Chinese Academy of Sciences, Beijing 100190, China.

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|February 28, 2023
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Summary

A novel negative-tone photosensitive polyimide (n-LTPI) was developed for microelectronics. This material achieves high-resolution photo-patterns and excellent thermal and mechanical properties after low-temperature curing, ideal for advanced packaging.

Keywords:
low-temperature imidizationmechanical propertiesphoto-patterningphotosensitive polyimide

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Area of Science:

  • Materials Science
  • Polymer Chemistry
  • Microelectronic Engineering

Background:

  • Polyimides are crucial in microelectronics due to their thermal stability and mechanical strength.
  • Developing photosensitive polyimides that cure at low temperatures is essential for advanced microelectronic packaging to minimize thermal stress.

Purpose of the Study:

  • To synthesize and characterize a low-temperature curable negative-tone photosensitive polyimide (n-LTPI).
  • To evaluate the photo-patterning capabilities and thermal/mechanical properties of the developed n-LTPI for microelectronic applications.

Main Methods:

  • Synthesis of photo-crosslinkable poly(amic ester) (pc-PAE) resin via polycondensation.
  • Formulation of n-LTPI viscous solutions with pc-PAE, photo-crosslinker, photoinitiator, and imidazole (IMZ) curing catalyst.
  • Fabrication of photo-patterns using spin-coating, UV exposure, development, and thermal curing.
  • Characterization using in situ FT-IR spectroscopy, tensile testing, and thermal analysis (DSC).

Main Results:

  • Achieved high-quality photo-patterns with 5 μm line/space resolution at 5 μm film thickness using n-LTPI with 2% IMZ.
  • Demonstrated 100% imidization degree after thermal curing at 230 °C for 2 hours.
  • Exhibited excellent mechanical properties (tensile strength: 189.0 MPa, tensile modulus: 3.7 GPa, elongation at breakage: 59.2%) and a high glass transition temperature (282.0 °C).

Conclusions:

  • The developed n-LTPI exhibits superior photo-patterning resolution and excellent thermal-mechanical performance.
  • The low-temperature curability and high imidization degree make this n-LTPI a promising candidate for advanced microelectronic packaging.
  • This material offers a viable solution for fabricating high-performance components in microelectronics.