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Laser ultrasonic imaging of subsurface defects with the linear sampling method.

Venkatalakshmi V Narumanchi, Fatemeh Pourahmadian, Jordan Lum

|March 2, 2023

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Laser ultrasonics non-contact imaging reconstructs subsurface features. The linear sampling method (LSM) accurately images internal geometry, outperforming conventional methods for advanced manufacturing applications.

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Area of Science:

Materials Science
Non-destructive Evaluation
Ultrasonic Testing

Background:

Laser ultrasonics offers remote, non-contact measurement capabilities.
Real-time monitoring is crucial for semiconductor metrology and advanced manufacturing.
Subsurface defect detection requires high-fidelity imaging techniques.

Purpose of the Study:

To investigate laser ultrasonic data processing for subsurface imaging.
To reconstruct images of side-drilled holes in aluminum alloy specimens.
To evaluate the effectiveness of the linear sampling method (LSM).

Main Methods:

Utilized laser ultrasonics for remote ultrasonic wave generation and detection.
Applied model-based linear sampling method (LSM) for data processing.
Performed simulations and experimental validation on aluminum alloy samples.

Main Results:

LSM accurately reconstructed the shape of single and multiple subsurface holes.
Simulations demonstrated well-defined boundaries in reconstructed images.
Experimental results confirmed LSM's ability to reveal internal geometric features missed by conventional imaging.

Conclusions:

Laser ultrasonics with LSM is a powerful technique for non-destructive evaluation.
LSM provides accurate subsurface imaging of internal geometric features.
This method enhances defect detection in advanced manufacturing and metrology.