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Published on: March 12, 2014
Silica-Fiber-Reinforced Composites for Microelectronic Applications: Effects of Curing Routes
Imran Haider1, Iftikhar Hussain Gul1, Malik Adeel Umer1
1Thermal Transport Laboratory, Department of Materials Engineering, School of Chemical and Materials Engineering (SCME), National University of Sciences and Technology (NUST), Islamabad 44000, Pakistan.
Microwave curing of silica-fiber-reinforced epoxy composites offers superior electrical, thermal, and mechanical properties compared to thermal curing. This advanced method provides enhanced performance with reduced energy consumption and faster processing times.
Area of Science:
- Materials Science
- Polymer Chemistry
- Composite Materials
Background:
- Traditional thermal curing (TC) of fiber-reinforced composites is energy-intensive and time-consuming.
- Microwave (MC) curing presents a promising alternative for rapid and energy-efficient composite fabrication.
- Fiber-reinforced epoxy composites are crucial for microelectronics applications.
Purpose of the Study:
- To comparatively analyze the functional characteristics of silica-fiber-reinforced epoxy composites cured by thermal and microwave energy.
- To evaluate the impact of MC versus TC on dielectric, structural, morphological, thermal, and mechanical properties.
- To determine the suitability of MC for microelectronic composite applications.
Main Methods:
- Silica fiber fabric/epoxy resin prepregs were cured using both thermal curing (TC) and microwave curing (MC) under controlled conditions.
- Comprehensive characterization included dielectric measurements, Fourier Transform Infrared Spectroscopy (FTIR), Dynamic Mechanical Analysis (DMA), and mechanical testing (tensile and compression).
Main Results:
- MC composites exhibited a lower dielectric constant (1%), lower dielectric loss factor (21.5%), and reduced weight loss (2.6%) compared to TC composites.
- DMA revealed a 20% increase in storage and loss modulus and a 15.5% increase in glass transition temperature (Tg) for MC composites.
- FTIR spectra were similar, but MC composites showed higher tensile (15.4%) and compression strength (4.3%).
Conclusions:
- Microwave-cured silica-fiber-reinforced epoxy composites demonstrate superior electrical, thermal, and mechanical properties over thermally cured counterparts.
- MC offers a faster, more energy-efficient curing process for high-performance composites in microelectronics.
- The enhanced properties and efficiency make MC a viable and advantageous alternative to TC for advanced composite manufacturing.
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