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Microstructure and Texture in Copper Filled Millimeter Scale Through Silicon Vias.

S-H Kim1, T M Braun2, H-J Lee1

  • 1Department of Materials Science and Engineering, Dong-A University, Saha-Gu, Busan 49315 Korea.

Journal of the Electrochemical Society
|March 20, 2023
PubMed
Summary

Copper electrodeposits in millimeter vias show microstructural changes with chloride concentration. Additives influence superconformal deposition, affecting grain orientation and filling behavior.

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Area of Science:

  • Materials Science
  • Electrochemistry
  • Surface Science

Background:

  • Superconformal deposition, also known as bottom-up filling, is crucial for fabricating microelectronic components.
  • Understanding the microstructure and crystallographic texture of electrodeposited copper is essential for reliable device performance.

Purpose of the Study:

  • To characterize the microstructure and crystallographic texture of copper electrodeposits in millimeter-scale through-silicon vias (TSVs).
  • To investigate the influence of chloride concentration on the deposition process and resulting material properties.

Main Methods:

  • Electron backscatter diffraction (EBSD) was used to analyze the microstructure and texture.
  • Copper electrodeposition was performed in additive-containing CuSO4-H2SO4 electrolytes with varying chloride concentrations.

Main Results:

  • Deposits exhibited textures and columnar grains consistent with superconformal growth.
  • Microstructure and filling evolution were significantly affected by chloride concentration.
  • At lower chloride concentrations (<80 µmol·L⁻¹), columnar grains with a <110> orientation were observed, angled towards the growth front.
  • At millimolar chloride concentrations, a convex growth front and spatially varying texture were observed due to deposit separation from sidewalls.

Conclusions:

  • Chloride concentration is a critical parameter controlling copper electrodeposition in millimeter-scale TSVs.
  • The study elucidates the structure-property relationships in superconformal copper deposition, offering insights for advanced fabrication processes.