Parametric study on conductive patterns by low-temperature sintering of micron silver ink

Area of Science:

• Materials Science
• Nanotechnology
• Electrical Engineering

Background:

• Fabricating dense conductive patterns is crucial for electronic applications.
• Low-temperature processing methods are desirable for flexible and cost-effective manufacturing.

Purpose of the Study:

• To investigate a novel method for fabricating dense conductive patterns using micron silver flakes.
• To explore the effects of sintering parameters on the morphology and electrical properties of silver patterns.
• To develop a rapid sintering technique for improved efficiency.

Main Methods:

• Sintering of 1-3 μm micron silver flakes with added 20-50 nm nanosilver particles.
• Investigation of sintering temperature, holding time, and heating rate effects.
• Implementation of a rapid sintering (RS) method by omitting the initial heating stage.

Main Results:

• Achieved dense conductive patterns via low-temperature sintering.
• Obtained low electrical resistivity of 10.8 × 10^-6 Ω cm at 140 °C for 30 min under 10 MPa pressure.
• Demonstrated significant durability with minimal resistivity change after 6000 bending cycles using RS for 20 min.

Conclusions:

• A new, efficient method for fabricating conductive silver patterns using micron silver flakes has been established.
• The developed rapid sintering technique offers excellent electrical conductivity and mechanical stability.
• This approach holds promise for advancing the application of silver inks in various electronic devices.