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Co-packaged optics (CPO): status, challenges, and solutions.

Min Tan1,2, Jiang Xu3,4,5, Siyang Liu6

  • 1School of Optical and Electronic Information, Huazhong University of Science and Technology, Wuhan, 430074, China. mtan@hust.edu.cn.

Frontiers of Optoelectronics
|March 20, 2023
PubMed
Summary
This summary is machine-generated.

Co-packaged optics (CPO) addresses the growing datacenter traffic demands by integrating photonics and electronics. This silicon-based approach enhances bandwidth density and energy efficiency for future high-performance computing.

Keywords:
Advanced packagingCo-packaged opticsCo-simulationExternal laserHigh-performance computingOptical power deliveryReceiverSilicon photonicsStandardizationTransmitter

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Area of Science:

  • Optoelectronics
  • Data Center Technology
  • Materials Science

Background:

  • Datacenter traffic is rapidly increasing due to 5G, IoT, AI, and high-performance computing, with nearly 75% of traffic internal to datacenters.
  • Conventional pluggable optics cannot keep pace with this traffic growth, creating an unsustainable gap between application needs and current capabilities.
  • Co-packaged optics (CPO) offers a disruptive solution to enhance interconnecting bandwidth density and energy efficiency.

Purpose of the Study:

  • To provide a comprehensive overview of the state-of-the-art progress in Co-packaged Optics (CPO) on silicon platforms.
  • To identify key challenges hindering CPO development and deployment.
  • To propose potential solutions and encourage inter-disciplinary collaboration.

Main Methods:

  • Review of current research and industry advancements in CPO technology.
  • Analysis of the integration of photonics and electronics using advanced packaging techniques.
  • Exploration of silicon photonics as the leading platform for large-scale CPO integration.

Main Results:

  • CPO significantly shortens electrical link lengths, boosting bandwidth density and energy efficiency.
  • Silicon platforms are identified as the most promising for scalable CPO integration.
  • Significant R&D investment from major tech companies highlights CPO's potential.

Conclusions:

  • CPO is a critical technology for meeting future datacenter interconnection demands.
  • Addressing challenges in photonic device modeling, electronic-photonic co-simulation, and standardization is crucial.
  • Inter-disciplinary collaboration is essential to accelerate CPO development and adoption.