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Tex Se1-x Photodiode Shortwave Infrared Detection and Imaging
Liuchong Fu1, Yuming He1, Jiajia Zheng1,2
1Wuhan National Laboratory for Optoelectronics (WNLO), School of Optical and Electronic Information (SOEI), Huazhong University of Science and Technology, Wuhan, Hubei, 430074, P. R. China.
A new low-cost, high-performance Te$_{x}$Se$_{1-x}$ photodiode detector offers a CMOS-compatible solution for short-wave infrared imaging. This stable device achieves fast response and high detectivity, enabling advanced applications.
Area of Science:
- Materials Science
- Optoelectronics
- Semiconductor Devices
Background:
- Short-wave infrared (SWIR) detectors are crucial for autonomous driving, food safety, disease diagnosis, and research.
- Existing SWIR cameras like InGaAs face challenges with complex integration, high costs, and limited resolution.
- Need for cost-effective, high-performance SWIR detectors compatible with standard fabrication processes.
Purpose of the Study:
- To develop a low-cost, high-performance, and stable Te$_{x}$Se$_{1-x}$ photodiode detector for SWIR imaging.
- To demonstrate CMOS compatibility for direct integration with readout circuits.
- To explore applications in material identification and masking imaging.
Main Methods:
- Fabrication of Te$_{x}$Se$_{1-x}$ thin films using CMOS-compatible low-temperature evaporation and post-annealing.
- Characterization of the photodiode detector's spectral response, detectivity, bandwidth, and dynamic range.
- Assessment of device stability using Si$_{3}$N$_{4}$ packaging.
Main Results:
- Broad spectral response from 300-1600 nm.
- Room-temperature specific detectivity of 1.0 × 10$^{10}$ Jones and a -3 dB bandwidth up to 116 kHz.
- Achieved fastest response among Te-based photodiodes with dark current density 7 orders of magnitude lower than alternative Te-based devices.
Conclusions:
- The developed Te$_{x}$Se$_{1-x}$ photodiode detector offers a low-cost, high-performance, and stable SWIR imaging solution.
- CMOS-compatible fabrication enables direct integration, paving the way for advanced SWIR imaging chips.
- Demonstrated potential for applications in material identification and masking imaging, meeting vehicular requirements.
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