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Paraffin-Multilayer Graphene Composite for Thermal Management in Electronics
Adriana Elena Balan1, Ali Al-Sharea1,2, Esmaeil Jalali Lavasani1
1Faculty of Physics, University of Bucharest, 3NanoSAE Research Center, 077125 Bucharest-Măgurele, Romania.
Materials (Basel, Switzerland)
|March 29, 2023
Summary
Adding multilayer graphene to paraffin wax significantly enhances thermal conductivity and reduces electronic processor temperatures. This composite material offers improved thermal buffering for electronic applications, boosting processor performance by up to 20%.
Area of Science:
- Materials Science
- Nanotechnology
- Thermal Engineering
Background:
- Paraffin wax is a phase-change material used for thermal buffering.
- Improving heat transfer in paraffin wax is crucial for efficient thermal management in electronics.
- Graphene is a promising material for enhancing thermal properties of composites.
Purpose of the Study:
- To prepare and characterize multilayer graphene-paraffin composites.
- To investigate the effect of graphene content on the thermal properties of paraffin wax.
- To evaluate the performance of these composites as thermal heat sinks for electronic processors.
Main Methods:
- Preparation of composites using an ultra-high shear mixer.
- Characterization using Raman spectroscopy, scanning electron microscopy, and atomic force microscopy.
- Thermal property analysis including differential scanning calorimetry and thermal conductivity measurements.
Main Results:
- Graphene addition slightly decreased energy storage capacity but increased thermal conductivity by 150% at 10 wt.% graphene.
- Morphological studies revealed paraffin intercalation within graphene flakes.
- Processor operating temperature was reduced by up to 20% with composites containing over 5 wt.% graphene.
Conclusions:
- Multilayer graphene-paraffin composites demonstrate enhanced thermal conductivity.
- These composites effectively reduce electronic processor operating temperatures.
- The developed phase-change material shows significant potential for improving electronic device performance through advanced thermal management.

