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Updated: Aug 5, 2025

A Simple and Scalable Fabrication Method for Organic Electronic Devices on Textiles
Published on: March 13, 2017
Adaptive Impedance Matching Network for Contactless Power and Data Transfer in E-Textiles
Pim Lindeman1, Annemarijn Steijlen1, Jeroen Bastemeijer1
1Faculty of Electronic Engineering, Mathematics and Computer Science, Delft University of Technology, 2628 CD Delft, The Netherlands.
This study introduces inductive coils for e-textile connections, enhancing user experience and reliability by eliminating galvanic connections. The new design supports power and data transfer across air gaps, improving performance over previous methods.
Area of Science:
- Materials Science
- Electrical Engineering
- Wearable Technology
Background:
- Connecting flexible e-textiles to rigid electronics presents a significant challenge.
- Conventional galvanic connections limit mechanical reliability and user experience in e-textile applications.
Purpose of the Study:
- To develop a novel connection method for e-textiles that improves mechanical reliability and user experience.
- To replace galvanic connections with inductively coupled coils for power and data transfer.
Main Methods:
- Utilized two pairs of inductively coupled coils to transmit power and bidirectional data across air gaps.
- Designed and analyzed a compensation network for the inductive link.
- Explored the system's sensitivity to varying environmental conditions.
- Developed a self-tuning mechanism based on current-voltage phase relationships.
Main Results:
- Demonstrated continuous power and bidirectional data transmission across millimeter-scale air gaps.
- Achieved a data transfer rate of 8.5 kbit/s with 62 mW DC power output in the proof-of-principle.
- Hardware demonstrated capability for data rates up to 240 kbit/s.
- The system exhibited self-tuning capabilities.
Conclusions:
- Inductively coupled coils offer a mechanically reliable and user-friendly alternative to galvanic connections in e-textiles.
- The proposed double inductive link system significantly improves upon previous e-textile connection designs.
- This approach enables robust integration of flexible electronics with rigid components.
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