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Charge-optimized many-body interaction potential for AlN revisited to explore plasma-surface interactions
Tobias Gergs1, Thomas Mussenbrock1, Jan Trieschmann2,3
1Chair of Applied Electrodynamics and Plasma Technology, Department of Electrical Engineering and Information Science, Ruhr University Bochum, 44780, Bochum, Germany.
A new reactive molecular dynamics (RMD) potential improves simulations of plasma-surface interactions during aluminum nitride (AlN) thin film deposition. This enhanced potential accurately models particle emission and defect formation, crucial for sputtering processes.
Area of Science:
- Materials Science
- Computational Physics
- Surface Science
Background:
- Accurate simulation of plasma-surface interactions is crucial for optimizing thin film deposition processes like sputtering.
- Existing reactive molecular dynamics (RMD) potentials for aluminum nitride (AlN) have limitations in describing surface interactions.
- Previous focus on bulk AlN potentials neglects essential surface phenomena such as particle emission and defect formation.
Purpose of the Study:
- To develop a revised charge-optimized many-body (COMB3) potential for AlN suitable for RMD simulations.
- To accurately describe plasma-surface interactions, including high-energy collisions and charge transport.
- To enable reliable investigation of ion bombardment effects on AlN surfaces.
Main Methods:
- Modification of the Ziegler-Biersack-Littmark potential and implementation of the QTE[Formula: see text] variable charge model.
- Reworking of the COMB3 potential parameterization using a self-adaptive evolution strategy within the GARFfield software.
- Consideration of multiple AlN surface structures (wurtzite, zinc blende, rock salt).
Main Results:
- A revised COMB3 AlN potential was successfully developed, incorporating improved descriptions of surface interactions.
- The new potential accurately models high-energy collisions and charge transport phenomena.
- Simulations demonstrated the potential's capability in studying ion bombardment-induced particle emission and point defect formation.
Conclusions:
- The revised COMB3 AlN potential is well-suited for accurate RMD investigations of plasma-surface interactions.
- This advancement facilitates a deeper understanding of sputtering deposition mechanisms for AlN thin films.
- The developed potential is a valuable tool for optimizing thin film growth and material properties.
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