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Monolithic integration of embedded III-V lasers on SOI
Wen-Qi Wei1,2, An He3, Bo Yang1,4
1Institute of Physics, Chinese Academy of Sciences, Beijing, China.
Light, Science & Applications
|April 3, 2023
Summary
Researchers achieved monolithic integration of InAs/GaAs quantum dot lasers on silicon-on-insulator (SOI) substrates. This breakthrough enables scalable, cost-effective on-chip light sources for dense photonic integration.
Area of Science:
- Photonics
- Materials Science
- Semiconductor Engineering
Background:
- Silicon photonics offers excellent device properties and CMOS compatibility.
- Monolithic integration of III-V lasers with silicon photonics remains a significant challenge for ultra-dense integration.
Purpose of the Study:
- To demonstrate monolithic integration of III-V quantum dot lasers directly grown on silicon-on-insulator (SOI) substrates.
- To overcome long-standing obstacles in on-chip light source development for photonic integration.
Main Methods:
- Direct epitaxial growth of InAs/GaAs quantum dot (QD) lasers on trenched SOI substrates using hybrid molecular beam epitaxy (MBE).
- Utilizing patterned grating structures within SOI trenches for monolithic out-coupling.
- Addressing epitaxy and fabrication challenges in the integrated architecture.
Main Results:
- Achieved high-performance embedded InAs QD lasers monolithically integrated with butt-coupled silicon waveguides.
- Demonstrated continuous-wave (CW) lasing up to 85°C.
- Measured maximum output power of 6.8 mW from silicon waveguides with ~ -6.7 dB coupling efficiency.
Conclusions:
- Presented a scalable, low-cost epitaxial method for on-chip III-V lasers on SOI.
- Enabled direct coupling of light sources to silicon photonic components.
- Paved the way for future high-density photonic integration.
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