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Updated: Aug 3, 2025

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies
Published on: March 20, 2015
Kun Liao1, Yangguang Zhong2, Zhuochen Du1
1State Key Laboratory for Mesoscopic Physics and Department of Physics, Collaborative Innovation Center of Quantum Matter, Beijing Academy of Quantum Information Sciences, Nano-optoelectronics Frontier Center of Ministry of Education, Peking University, Beijing 100871, China.
Researchers developed a scalable strategy for robust on-chip visible microlasers. This innovation enhances lasing performance and supports high-speed visible-light communication systems.
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