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Updated: Aug 3, 2025

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies
Published on: March 20, 2015
On-chip integrated exceptional surface microlaser
Kun Liao1, Yangguang Zhong2, Zhuochen Du1
1State Key Laboratory for Mesoscopic Physics and Department of Physics, Collaborative Innovation Center of Quantum Matter, Beijing Academy of Quantum Information Sciences, Nano-optoelectronics Frontier Center of Ministry of Education, Peking University, Beijing 100871, China.
Abstract:
The on-chip integrated visible microlaser is a core unit of high-speed visible-light communication with huge bandwidth resources, which needs robustness against fabrication errors, compressible linewidth, reducible threshold, and in-plane emission. However, until now, it has been a great challenge to meet these requirements simultaneously. Here, we report a scalable strategy to realize a robust on-chip integrated visible microlaser with further improved lasing performances enabled by the increased orders (n) of exceptional surfaces, and experimentally verify the strategy by demonstrating the performances of a second-order exceptional surface-tailored microlaser. We further prove the potential application of the strategy by discussing an exceptional surface-tailored topological microlaser with unique performances. This work lays a foundation for further development of on-chip integrated high-speed visible-light communication and processing systems, provides a platform for the fundamental study of non-Hermitian photonics, and proposes a feasible method of joint research for non-Hermitian photonics with nonlinear optics and topological photonics.

