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Updated: Aug 2, 2025

Ohmic Contact Fabrication Using a Focused-ion Beam Technique and Electrical Characterization for Layer Semiconductor Nanostructures
Published on: December 5, 2015
Ultrascaled Contacts to Monolayer MoS2 Field Effect Transistors
Thomas F Schranghamer1, Najam U Sakib1, Muhtasim Ul Karim Sadaf1
1Department of Engineering Science and Mechanics, Pennsylvania State University, University Park, Pennsylvania 16802, United States.
Scaling down contact lengths in two-dimensional (2D) semiconductor field-effect transistors (FETs) significantly reduces ON-current due to current crowding. This study quantifies these effects in molybdenum disulfide (MoS2) FETs with nanoscale contacts.
Area of Science:
- Materials Science
- Nanotechnology
- Semiconductor Physics
Background:
- Two-dimensional (2D) semiconductors offer potential for advanced field-effect transistors (FETs) due to their electrostatic control.
- Scaling FETs requires reducing both channel length (L_CH) and contact length (L_C), but nanoscale contact scaling is challenging.
Purpose of the Study:
- To investigate the impact of scaling contact length (L_C) on the performance of monolayer molybdenum disulfide (MoS2) FETs.
- To evaluate current crowding effects at nanoscale contacts in 2D semiconductor FETs.
Main Methods:
- Fabrication and characterization of monolayer MoS2 FETs with varying channel lengths (down to 100 nm) and contact lengths (down to 20 nm).
- Electrical measurements to assess ON-current and other performance metrics.
Main Results:
- A significant reduction in ON-current (approximately 2.5x) was observed as contact length (L_C) scaled from 300 nm to 20 nm.
- Current crowding effects become pronounced at nanoscale contact dimensions, impacting device performance.
Conclusions:
- Contact scaling is a critical factor limiting FET performance in 2D materials.
- Accurate modeling of contact effects is essential for future nanoscale electronic devices, particularly beyond current silicon technology nodes.
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