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Thermal conductivity across transition metal dichalcogenide bilayers
Insa F de Vries1, Helena Osthues1, Nikos L Doltsinis1
1Institut für Festkörpertheorie, Westfälische Wilhelms-Universität Münster and Center for Multiscale Theory & Computation, Wilhelm-Klemm-Str. 10, 48149 Münster, Germany.
Transition metal dichalcogenide (TMD) bilayers exhibit varying thermal conductivities. Tungsten diselenide (WSe2) and molybdenum disulfide (MoS2) bilayers show the best insulating properties, crucial for thermal management applications.
Area of Science:
- Materials Science
- Condensed Matter Physics
- Nanotechnology
Background:
- Transition metal dichalcogenides (TMDs) are layered materials with unique electronic and thermal properties.
- Understanding their thermal conductivity is vital for applications in electronics and thermoelectrics.
Purpose of the Study:
- To determine the cross-plane thermal conductivities of various transition metal dichalcogenide (M=Mo, W; X=S, Se) bilayers.
- To investigate the influence of atomic mass, lattice constant, and interlayer interactions on thermal transport.
Main Methods:
- Homogeneous nonequilibrium molecular dynamics simulations were employed.
- Phonon spectral analysis was used to understand heat transport mechanisms.
- Slack's formula was utilized for rationalizing thermal conductivity trends.
Main Results:
- Tungsten diselenide (WSe2) and molybdenum disulfide (MoS2) bilayers exhibited the lowest thermal conductivities, acting as effective insulators.
- Heterobilayer thermal conductivities approximated the average of their constituent homobilayers.
- Boundary scattering significantly influenced thermal transport, while spectral overlap had minimal impact.
Conclusions:
- The thermal conductivity of TMD bilayers is primarily governed by average atomic mass and Debye temperature, as predicted by Slack's formula.
- Interlayer interaction potentials, even when accurately modeled, have a minor effect on cross-plane thermal conductivity.
- The findings provide insights for designing materials with tailored thermal properties for advanced applications.
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