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Updated: Aug 2, 2025
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Evaluation of the Curing of Adhesive Systems by Rheological and Thermal Testing
Published on: July 3, 2020
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Dynamic behaviours of epoxy resin thin films during the curing process
Taiki Hoshino1,2,3, Yasushi Okamoto4, Atsushi Yamamoto4
1International Center for Synchrotron Radiation Innovation Smart (SRIS), Tohoku University, 2-1-1 Katahira, Aoba-ku, Sendai 980-8577, Japan. taiki.hoshino.c7@tohoku.ac.jp.
Soft Matter
|April 21, 2023
Summary
Researchers studied epoxy resin thin films during curing using X-ray photon correlation spectroscopy. They observed the freezing of surface capillary waves, offering new insights into thin film curing dynamics.
Area of Science:
- Materials Science
- Polymer Science
- Surface Science
Background:
- Epoxy resin thin films are crucial in coatings, insulation, and adhesives.
- Their physical properties depend heavily on curing conditions (temperature, time).
- Dynamic properties during epoxy curing remain understudied.
Purpose of the Study:
- Investigate dynamic behaviors of epoxy resin thin films during thermal curing.
- Elucidate the curing mechanisms through surface dynamics analysis.
Main Methods:
- Utilized grazing-incidence X-ray photon correlation spectroscopy (GIXPC).
- Analyzed thermal fluctuations on the surface of epoxy resin thin films.
Main Results:
- Successfully observed the freezing of capillary waves during thermal curing.
- Provided direct evidence of dynamic changes at the film surface.
Conclusions:
- The study offers a novel method for understanding thin film curing dynamics.
- Results enhance comprehension of thermoset thin film curing mechanisms.
- Findings are applicable to various thin film materials and applications.
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