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Updated: Aug 2, 2025

Evaluation of the Curing of Adhesive Systems by Rheological and Thermal Testing
Published on: July 3, 2020
Dynamic behaviours of epoxy resin thin films during the curing process
Taiki Hoshino1,2,3, Yasushi Okamoto4, Atsushi Yamamoto4
1International Center for Synchrotron Radiation Innovation Smart (SRIS), Tohoku University, 2-1-1 Katahira, Aoba-ku, Sendai 980-8577, Japan. taiki.hoshino.c7@tohoku.ac.jp.
Abstract:
Epoxy resin thin films are widely used in applications such as coating materials, insulator films, and adhesives; accordingly, investigations of their physical properties have garnered increasing importance. Although the physical properties of thermoset epoxy thin films are strongly affected by the curing conditions, such as the heating temperature and curing time, the dynamic properties during the curing process have not been studied thoroughly. In this study, we investigated the thermal fluctuations on the surface of epoxy resin thin films using grazing-incidence X-ray photon correlation spectroscopy, to elucidate the dynamic behaviours during the curing process. We thus succeeded in observing the freezing of capillary waves during the thermal curing process. These results are expected to facilitate a deeper understanding of the curing mechanisms of various thin films.
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