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Related Experiment Video

Updated: Aug 1, 2025

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Additive 3D photonic integration that is CMOS compatible.

Adrià Grabulosa1, Johnny Moughames1, Xavier Porte1

  • 1Institut FEMTO-ST, Université Franche-Comté, CNRS UMR6174, Besançon, France.

Nanotechnology
|April 27, 2023
PubMed
Summary

Researchers developed 3D-printed photonic circuits using photo-resin, enabling scalable optical neural networks. This advancement offers a path towards integrating electronics and photonics on a single chip, overcoming miniaturization limits.

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Area of Science:

  • Photonics and Optical Engineering
  • Materials Science
  • Integrated Circuit Design

Background:

  • Electronic integrated circuits (ICs) face fundamental miniaturization limits (∼2 nm feature size).
  • Energy consumption in electronic ICs, especially for communication and neural networks, is a major challenge.
  • Three-dimensional (3D) integration offers a strategy to improve IC architecture beyond 2D limitations.

Purpose of the Study:

  • To review advancements in 3D photonic integration using additive photopolymerization.
  • To demonstrate CMOS-compatible fabrication of 3D photonic circuits for hybrid integration.
  • To explore the application of these circuits in optical neural networks.

Main Methods:

  • Utilized additive photo-induced polymerization of standard photo-resin.
Keywords:
3D photonic integrationadditive manufacturingphotonic neural networks

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  • Employed one- and two-photon polymerization (TPP), including flash-TPP, combined with direct-laser writing.
  • Fabricated air- and polymer-cladded photonic waveguides and adiabatic couplers.

    • Main Results:

    • Demonstrated 3D-printed polymer-cladded waveguides (up to 6 mm length) with low insertion (∼0.26 dB) and propagation (∼1.3 dB mm⁻¹) losses.
    • Achieved broadband, low-loss (∼0.06 dB splitting losses) adiabatic 1 to M couplers.
    • Successfully printed integrated photonic circuits on semiconductor samples, confirming CMOS compatibility.

    Conclusions:

    • Additive photopolymerization enables truly 3D photonic integration compatible with CMOS processes.
    • 3D photonic circuits are crucial for scalable interconnects in optical neural networks.
    • This approach provides a promising pathway for scalable hybrid photonic-electronic integration.