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An apparatus for probing multipactor in X-band waveguide components.

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Multipactor discharge in rectangular waveguides can damage RF components. This study demonstrates a sensitive, high-resolution method for detecting multipactor and presents initial findings on surface conditioning using electron bombardment.

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Area of Science:

  • Physics
  • Electrical Engineering
  • Materials Science

Background:

  • Rectangular waveguides are prone to multipactor discharge, a phenomenon causing secondary electron multiplication.
  • Multipactor can lead to significant damage and failure of Radio Frequency (RF) components.
  • Mitigating multipactor is crucial for the reliability of high-power microwave systems.

Purpose of the Study:

  • To develop a sensitive and high-temporal-resolution method for detecting multipactor discharge.
  • To investigate the effectiveness of surface conditioning via electron bombardment on mitigating multipactor.
  • To enable testing of various surface geometries and coatings for multipactor suppression.

Main Methods:

  • Utilized a pulse-adjustable, hard-switched modulator powering an X-band magnetron to drive experiments.
  • Integrated power and phase measurements using diodes and a double-balanced mixer for sensitive multipactor detection.
  • Employed a modular experimental setup for testing different surface geometries and coatings.
  • Conducted threshold testing without initial electron seeding using a 150 kW peak microwave source (2.5 μs pulse width, 100 Hz repetition frequency).

Main Results:

  • Achieved nanosecond temporal resolution for multipactor detection.
  • Demonstrated the capability for threshold testing without requiring initial electron seeding.
  • Presented initial results on surface conditioning of the multipactor gap via electron bombardment.

Conclusions:

  • The developed apparatus enables highly sensitive and temporally resolved multipactor detection.
  • Electron bombardment shows promise as a surface conditioning technique for mitigating multipactor.
  • Further research into surface treatments and geometries is warranted for robust RF component design.