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Partial Segregation of Bi and Microvoid Formation on a Pure Cu Substrate After Solid-Solid Reactions.

Yi-Wun Wang1,2, Hua-Tui Liang1, Kai-Chia Chang1

  • 1Department of Chemical and Materials Engineering, Tamkang University, New Taipei City, Taiwan.

Journal of Electronic Materials
|May 9, 2023
PubMed
Summary

This study investigates Sn58Bi low-temperature solder for semiconductor packaging, finding that Bi segregation and microvoids after aging negatively impact solder joint strength and reliability.

Keywords:
Carbon reductionSn58Bipartial Bi segregationsemiconductor

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Area of Science:

  • Materials Science
  • Semiconductor Manufacturing
  • Metallurgy

Background:

  • Growing demand for energy efficiency and carbon reduction necessitates lower processing temperatures in semiconductor manufacturing.
  • Moore's Law limitations drive focus on back-end semiconductor processes, where high-temperature bonding poses cost and device damage risks.
  • Low-temperature solders are crucial for reducing process temperatures in semiconductor packaging.

Purpose of the Study:

  • To investigate the interfacial reactions between Sn58Bi solder and copper (Cu) under reflow and aging conditions.
  • To evaluate the impact of these interfacial changes on the reliability and strength of solder joints.
  • To assess the potential of Sn58Bi as a low-temperature solder for energy-saving semiconductor packaging.

Main Methods:

  • Utilized Sn58Bi low-temperature solder for interfacial reaction studies.
  • Conducted reflow and aging experiments on Sn58Bi/Cu interfaces.
  • Analyzed interfacial microstructures using microscopy and compositional analysis techniques.

Main Results:

  • Observed Bi segregation at the Sn58Bi/Cu interface after aging, influenced by Bi solubility in Sn.
  • Identified microvoid formation and uneven Cu3Sn intermetallic compound growth at the interface post-aging.
  • These interfacial structural changes were found to be detrimental to solder joint strength.

Conclusions:

  • Sn58Bi solder offers a pathway for reducing process temperatures in semiconductor packaging.
  • Aging effects, including Bi segregation and microvoids, significantly degrade the mechanical integrity of Sn58Bi/Cu solder joints.
  • Further research is needed to mitigate interfacial degradation for reliable low-temperature semiconductor packaging.