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Nanometer Sized Direct Laser-Induced Gold Printing for Precise 2D-Electronic Device Fabrication
Olympia Geladari1, Martin Eberle1, Andre Maier1,2
1Institut für Physikalische und Theoretische Chemie, Universität Tübingen, D-72076, Tübingen, Germany.
Small Methods
|May 12, 2023
Summary
This study introduces a new direct laser writing method for creating fine gold electrical circuits on flexible materials. This technique enables high-resolution, adaptable electronics fabrication without post-treatment, paving the way for personalized circuits.
Area of Science:
- Materials Science
- Nanotechnology
- Electrical Engineering
Background:
- Flexible electronics manufacturing is crucial for integrated photonic and electronic devices.
- Direct laser induced writing (DIW) offers adaptable electronics fabrication but often uses oxidizable silver with limited resolution.
- Existing DIW methods face challenges with material compatibility and resolution for advanced applications.
Purpose of the Study:
- To develop a high-resolution DIW technique for fabricating electrical gold wiring on 2D van-der-Waals materials.
- To demonstrate the fabrication of sub-micrometer structures and functional electronic components like photoswitches and field-effect transistors.
- To enable adaptable and personalized circuit production on diverse substrates, including curved surfaces.
Main Methods:
- Utilized a novel DIW technique employing light-sensitive metalloid Au32-nanoclusters as ink.
- Employed low-power continuous-wave laser exposure for precise material deposition.
- Implemented a simple lift-off procedure to remove unexposed ink, enabling pattern creation.
Main Results:
- Achieved electrical gold wiring of 2D van-der-Waals materials with sub-micrometer structures and 100 nm interspacing resolution.
- Successfully fabricated photoswitches and field-effect transistors on both rigid and elastic materials.
- Demonstrated ultrafast, high-resolution, and high-precision production of integrated electronics.
Conclusions:
- The developed DIW technique offers a versatile and high-performance solution for advanced flexible electronics.
- This method overcomes limitations of previous DIW approaches, enabling finer feature sizes and broader material compatibility.
- The technology holds potential for personalized circuit manufacturing and applications on non-planar surfaces.
