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Direct-Writing Flexible Metal Circuit with Polymer/Metal Precursor Ink and Interfacial Reaction
Rui Sun1, Mengdi Ma1, Xiangcai Ma2
1Key Laboratory of Pulp and Paper Science & Technology of Ministry of Education, State Key Laboratory of Biobased Material and Green Papermaking, Faculty of Light Industry, Qilu University of Technology (Shandong Academy of Sciences), Jinan 250353, China.
Abstract:
In this study, flexible metal circuits are fabricated with polymer/metal precursor ink and an interfacial reaction by direct-writing technology. Poly(vinyl alcohol) (PVA) is selected as one component of ink, which could be a flexible composite in a metal circuit and an adhesive layer to connect the flexible metal circuit with the flexible substrate. Silver nitrate (AgNO3) is added to the ink as a source of metal. After the direct-writing structure was placed in contact with an ascorbic acid (VC) aqueous solution with an adjustable process, silver nanoparticles (AgNPs) with 100-400 nm uniform size could be generated on the direct-writing PVA skeleton. The resistivity of the composite silver layer could reach 10-6 Ω·m without any postprocessing. Meanwhile, the resistance change could keep within 20% with 180° bending after 10 000 repeat times. Patterned flexible metal circuits could be facilely fabricated by direct-writing technology, which presented excellent electrical conductivity and flexibility.
