Related Experiment Video
Updated: Jul 29, 2025

Fabrication of Superhydrophobic Metal Surfaces for Anti-Icing Applications
Published on: August 15, 2018
Fabrication and Experimental Study of Micro/Sub-Micro Porous Copper Coating for Anti-Icing Application
Jingxiang Chen1,2, Cheng Fu1, Junye Li3
1Facility Design and Instrumentation Institute, China Aerodynamics Research and Development Center, Mianyang 621000, China.
Abstract:
Micro and sub-micro-spherical copper powder slurries were elaborately prepared to fabricate different types of porous coating surfaces. These surfaces were further treated with low surface energy modification to obtain the superhydrophobic and slippery capacity. The surface wettability and chemical component were measured. The results showed that both the micro and sub-micro porous coating layer greatly increased the water-repellence capability of the substrate compared with the bare copper plate. Notably, the PFDTES-fluorinated coating surfaces yielded superhydrophobic ability against water under 0 °C with a contact angle of ~150° and a contact angle of hysteresis of ~7°. The contact angle results showed that the water repellency of the coating surface deteriorated with decreasing temperature from 10 °C to -20 °C, and the reason was probably recognized as the vapor condensation in the sub-cooled porous layer. The anti-icing test showed that the ice adhesion strengths of the micro and sub-micro-coated surfaces were 38.5 kPa and 30.2 kPa, producing a 62.8% and 72.7% decrease compared to the bare plate. The PFDTES-fluorinated and slippery liquid-infused porous coating surfaces both produced ultra-low ice adhesion strengths of 11.5-15.7 kPa compared with the other non-treated surfaces, which showed prominent properties for anti-icing and deicing requirement of the metallic surface.
More Related Videos
07:37TiO2-coated Hollow Glass Microspheres with Superhydrophobic and High IR-reflective Properties Synthesized by a Soft-chemistry Method
Published on: April 26, 2017
07:20Fabrication of Micro-Patterned Chip with Controlled Thickness for High-Throughput Cryogenic Electron Microscopy
Published on: April 21, 2022