Microstructural Changes Caused by the Creep Test in ZK60 Alloy Reinforced by SiC_p at Intermediate Temperature after...

In this study, we investigated the creep properties of ZK60 alloy and a ZK60/SiC_p composite at 200 °C and 250 °C in the 10-80 MPa stress range after the KOBO extrusion and precipitation hardening process. The true stress exponent was obtained in the range of 1.6-2.3 for both the unreinforced alloy and the composite. The apparent activation energy of the unreinforced alloy was found to be in the range of 80.91-88.09 kJ/mol, and that of the composite was found to be in the range of 47.15-81.60 kJ/mol, and this indicated the grain boundary sliding (GBS) mechanism. An investigation of crept microstructures using an optical microscope and scanning electron microscope (SEM) showed that at 200 °C, the predominant strengthening mechanisms at low stresses were the formation of twin, double twin, and shear bands, and that by increasing the stress, kink bands were activated. At 250 °C, it was found that a slip band was created in the microstructure, and this effectively delayed GBS. The failure surfaces and adjacent regions were examined using SEM, and it was discovered that the primary cause of failure was cavity nucleation around precipitations and reinforcement particles.