Jove
Visualize
Contact Us
JoVE
x logofacebook logolinkedin logoyoutube logo
ABOUT JoVE
OverviewLeadershipBlogJoVE Help Center
AUTHORS
Publishing ProcessEditorial BoardScope & PoliciesPeer ReviewFAQSubmit
LIBRARIANS
TestimonialsSubscriptionsAccessResourcesLibrary Advisory BoardFAQ
RESEARCH
JoVE JournalMethods CollectionsJoVE Encyclopedia of ExperimentsArchive
EDUCATION
JoVE CoreJoVE BusinessJoVE Science EducationJoVE Lab ManualFaculty Resource CenterFaculty Site
Terms & Conditions of Use
Privacy Policy
Policies

Related Concept Videos

You might also read

Related Articles

Articles linked to this work by shared authors, journal, and citation graph.

Sort by
Same journal

Design Strategies for Developing Chiral Macrocyclic Chelators as a Diagnostic Tool.

Accounts of chemical research·2026
Same journal

Small-Molecule NIR-II Probes for Biological Imaging: A Four-Dimensional Design Framework.

Accounts of chemical research·2026
Same journal

Self-Driving Scanning Probe Microscopy: From Acceleration to Discovery and Manipulation.

Accounts of chemical research·2026
Same journal

Photoredox-Mediated Radical Smiles-Truce Rearrangement: From Aryl Migration to Molecular Complexity Generation.

Accounts of chemical research·2026
Same journal

Carbon Dots for Electroluminescence: Bridging Molecular Fluorophores and Quantum Emitters.

Accounts of chemical research·2026
Same journal

Light-Driven Oxidation of Light Alkanes: Current Challenges and Prospects.

Accounts of chemical research·2026

Related Experiment Video

Updated: Jul 27, 2025

Fabrication of Low Temperature Carbon Nanotube Vertical Interconnects Compatible with Semiconductor Technology
09:20

Fabrication of Low Temperature Carbon Nanotube Vertical Interconnects Compatible with Semiconductor Technology

Published on: December 7, 2015

7.8K

Copper-Based Nanomaterials for Fine-Pitch Interconnects in Microelectronics.

Ezer Castillo1, Michael Njuki1, Abdullah Faisal Pasha1

  • 1Department of Chemistry, State University of New York at Binghamton, P.O. Box 6000 Binghamton, New York 13902-6000, USA.

Accounts of Chemical Research
|June 8, 2023
PubMed
Summary

Nanostructured copper-tin films enable low-temperature electronic interconnections. This electrochemical approach creates robust, reliable Cu-Sn alloy joints for advanced packaging, outperforming traditional methods.

More Related Videos

Generation of Scalable, Metallic High-Aspect Ratio Nanocomposites in a Biological Liquid Medium
13:34

Generation of Scalable, Metallic High-Aspect Ratio Nanocomposites in a Biological Liquid Medium

Published on: July 8, 2015

9.2K
Scalable Solution-processed Fabrication Strategy for High-performance, Flexible, Transparent Electrodes with Embedded Metal Mesh
11:09

Scalable Solution-processed Fabrication Strategy for High-performance, Flexible, Transparent Electrodes with Embedded Metal Mesh

Published on: June 23, 2017

10.2K

Related Experiment Videos

Last Updated: Jul 27, 2025

Fabrication of Low Temperature Carbon Nanotube Vertical Interconnects Compatible with Semiconductor Technology
09:20

Fabrication of Low Temperature Carbon Nanotube Vertical Interconnects Compatible with Semiconductor Technology

Published on: December 7, 2015

7.8K
Generation of Scalable, Metallic High-Aspect Ratio Nanocomposites in a Biological Liquid Medium
13:34

Generation of Scalable, Metallic High-Aspect Ratio Nanocomposites in a Biological Liquid Medium

Published on: July 8, 2015

9.2K
Scalable Solution-processed Fabrication Strategy for High-performance, Flexible, Transparent Electrodes with Embedded Metal Mesh
11:09

Scalable Solution-processed Fabrication Strategy for High-performance, Flexible, Transparent Electrodes with Embedded Metal Mesh

Published on: June 23, 2017

10.2K

Area of Science:

  • Materials Science
  • Nanotechnology
  • Electronic Packaging

Background:

  • Nanostructured copper (Cu) materials offer improved compliance and lower sintering temperatures for electronic packaging interconnects.
  • Nanoporous Cu (np-Cu) films are used for chip-to-substrate interconnection via Cu-on-Cu bonding.
  • Existing methods face limitations in achieving optimal joint properties.

Purpose of the Study:

  • To investigate the use of self-supported np-Cu films for low-temperature joint formation.
  • To develop a novel approach by incorporating tin (Sn) into np-Cu structures for enhanced sintering.
  • To create Cu-Sn intermetallic alloy-based joints between Cu substrates at reduced temperatures.

Main Methods:

  • Utilized an all-electrochemical bottom-up approach for Sn incorporation.
  • Employed galvanic pulse plating to conformally coat np-Cu with Sn, preserving porosity.
  • Optimized Cu/Sn atomic ratio for Cu6Sn5 intermetallic compound (IMC) formation.
  • Sintered nanomaterials at 200-300 °C under pressure for joint formation.

Main Results:

  • Synthesized nanostructured Cu-Sn films with preserved porosity.
  • Achieved densified Cu-Sn joints with minimal porosity post-sintering.
  • Identified predominantly Cu3Sn IMC in the formed joints.
  • Demonstrated improved structural consistency compared to purely np-Cu joints.

Conclusions:

  • Developed a facile and cost-effective method for synthesizing nanostructured Cu-Sn films.
  • Validated the applicability of these Cu-Sn nanomaterials as advanced interconnect materials.
  • Highlighted the potential for low-temperature, high-reliability electronic packaging solutions.