Performance Study of Diamond Powder-Filled Sodium Silicate-Based Thermal Conductive Adhesives

Area of Science:

• Materials Science
• Nanotechnology
• Chemical Engineering

Background:

• Electronic devices generate significant heat, necessitating efficient heat dissipation solutions.
• Existing organic thermal conductive adhesives face limitations in balancing thermal conductivity and mechanical properties.

Purpose of the Study:

• To develop a new inorganic thermal conductive adhesive with improved thermal and mechanical properties.
• To investigate the effect of diamond powder content on the performance of sodium silicate-based thermal conductive adhesives.

Main Methods:

• Preparation of inorganic thermal conductive adhesives using a sodium silicate matrix and modified diamond powder.
• Systematic characterization including thermal conductivity testing, tensile shear strength measurement, SEM, XRD, FTIR, and EDS analysis.
• Optimization of diamond powder content (50-60% mass fraction) for enhanced performance.

Main Results:

• The inorganic thermal conductive adhesive exhibited optimal adhesive performance (1.83 MPa tensile shear strength) at 60% diamond content.
• Maximum thermal conductivity (10.32 W/(m·K)) was achieved at 50% diamond content.
• A balance of excellent adhesive and thermal properties was observed between 50% and 60% diamond content.

Conclusions:

• The developed inorganic thermal conductive adhesive based on sodium silicate and diamond shows superior comprehensive performance.
• This material presents a viable alternative to conventional organic thermal conductive adhesives.
• The findings offer new avenues for the development and application of inorganic thermal conductive materials.