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Updated: Jul 27, 2025

Accumulation and Analysis of Cuprous Ions in a Copper Sulfate Plating Solution
Published on: March 20, 2019
Copper removal and recovery from electroplating effluent with wide pH ranges through hybrid capacitive deionization
Shiyong Wang1, Haohong Zhuang1, Xiaoyan Shen1
1School of Environment and Civil Engineering, Research Center for Eco-Environment Engineering, Dongguan University of Technology, Dongguan 523106, Guangdong, PR China.
Abstract:
In modern industry, selective extraction and recovery of Cu from strongly acidic electroplating effluent are crucial to reduce carbon emissions, alleviate resource scarcity, and mitigate water pollution, yielding considerable economic and environmental benefits. This study proposed a high-efficiency CuSe electrode to selectively remove Cu from electroplating effluent via hybrid capacitive deionization (HCDI). The potential of this electrode was thoroughly evaluated to assess its effectiveness. The CuSe electrode exhibited superior deionization performance in terms of Cu adsorption capacity, selectivity, and applicability in various water matrices. Specifically, under strong acid conditions (1 M H+), the CuSe electrode maintained an optimal adsorption capacity of 357.36 mg g-1 toward Cu2+. In systems containing salt ions, heavy metals, and actual electroplating wastewater, the CuSe electrode achieved a remarkable removal efficiency of up to 90% for Cu2+ with a high distribution coefficient Kd. Notably, the capacitive deionization (CDI) system demonstrated the simultaneous removal of Cu-EDTA. The removal mechanism was further revealed using ex-situ X-ray diffraction and X-ray photoelectron spectroscopy analyses. Overall, this study presents a practical approach that extends the capabilities of CDI platforms for effectively removing and recovering Cu from acidic electroplating effluent.
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