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Laser-induced Forward Transfer of Ag Nanopaste

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High aspect ratio diamond nanosecond laser machining.

Natalie C Golota^1,2, David Preiss³, Zachary P Fredin³

¹Department of Chemistry, Massachusetts Institute of Technology, Cambridge, MA 02139 USA.

Applied Physics. A, Materials Science & Processing

|June 19, 2023

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Achieving high aspect ratio diamond structures for quantum devices is now possible. Rotary assisted laser drilling significantly increases aspect ratios, and subsequent heat treatment reduces laser-induced strain.

Area of Science:

Materials Science
Laser Physics
Quantum Technology

Background:

Laser processing is crucial for fabricating advanced microelectronic and quantum devices using diamond.
Achieving high aspect ratio and low taper structures in diamond via laser machining presents significant challenges.

Purpose of the Study:

To investigate the effects of laser pulse energy, number, and irradiation profile on diamond structure aspect ratio.
To explore methods for fabricating low taper, high aspect ratio diamond structures.
To analyze laser-induced damage and the efficacy of thermal annealing for strain reduction.

Main Methods:

Utilized 532 nm nanosecond laser machining with percussion and rotary assisted drilling techniques.
Investigated various pulse energies, pulse numbers (up to 2M), and irradiation profiles.

Keywords:

Diamond laser machining Fundamentals of laser processing Laser ablation Laser induced damage analysis Nanosecond laser machining

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Employed confocal Raman spectroscopy to study laser-induced strain and heat treatment effects.

Main Results:

Achieved aspect ratios of 22:1 with percussion drilling and >40:1 (up to 66:1) with rotary assisted drilling.
Demonstrated 0.1° taper angles using ramped pulse energy machining.
Observed up to 36% tensile strain increase post-irradiation, reduced by ~50% with 600°C heat treatment.

Conclusions:

Rotary assisted laser drilling is effective for achieving high aspect ratio diamond structures.
Laser machining parameters critically influence achievable aspect ratios and taper angles.
Thermal treatment can mitigate laser-induced strain in diamond, crucial for device stability.