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3D Printing of Copper Using Water-Based Colloids and Reductive Sintering
Lorenzo Airoldi1, Riccardo Brucculeri1, Primo Baldini2
1Department of Civil Engineering and Architecture, Computer, and Biomedical Engineering, University of Pavia, Pavia, Italy.
Abstract:
Copper was manufactured by using a low-cost 3D printing device and copper oxide water-based colloids. The proposed method avoids the use of toxic volatile solvents (used in metal-based robocasting), adopting copper oxide as a precursor of copper metal due to its lower cost and higher chemical stability. The appropriate rheological properties of the colloids have been obtained through the addition of poly-ethylene oxide-co-polypropylene-co-polyethylene oxide copolymer (Pluronic P123) and poly-acrylic acid to the suspension of the oxide in water. Mixing of the components of the colloidal suspension was performed with the same syringes used for the extrusion, avoiding any material waste. The low-temperature transition of water solutions of P123 is used to facilitate the homogenization of the colloid. The copper oxide is then converted to copper metal through a reductive sintering process, performed at 1000°C for a few hours in an atmosphere of Ar-10%H2. This approach allows the obtainment of porous copper objects (up to 20%) while retaining good mechanical properties. It could be beneficial for many applications, for example current collectors in lithium batteries.
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