Related Experiment Video

Updated: Jul 25, 2025

Metal-silicate Partitioning at High Pressure and Temperature: Experimental Methods and a Protocol to Suppress Highly Siderophile Element Inclusions
11:50

Metal-silicate Partitioning at High Pressure and Temperature: Experimental Methods and a Protocol to Suppress Highly Siderophile Element Inclusions

Published on: June 13, 2015

12.6K

Migration Behavior of Inclusions at the Solidification Front in Oxide Metallurgy

Chunliang Yan1,2, Fengming Wang3, Wenling Mo4

  • 1College of Metallurgy and Energy, North China University of Science and Technology, Tangshan 063210, China.

Materials (Basel, Switzerland)
|June 28, 2023
PubMed

Keywords:
in situ observationinclusion migration behaviormicrostructuresolidification front

More Related Videos

Methods of Ex Situ and In Situ Investigations of Structural Transformations: The Case of Crystallization of Metallic Glasses08:55

Methods of Ex Situ and In Situ Investigations of Structural Transformations: The Case of Crystallization of Metallic Glasses

Published on: June 7, 2018

8.6K
Tuning Oxide Properties by Oxygen Vacancy Control During Growth and Annealing06:44

Tuning Oxide Properties by Oxygen Vacancy Control During Growth and Annealing

Published on: June 9, 2023

3.2K

Related Concept Videos

Bonding in Metals02:32

Bonding in Metals

Metallic bonds are formed between two metal atoms. A simplified model to describe metallic bonding has been developed by Paul Drüde called the “Electron Sea Model”. 
47.5K
Metallic Solids02:37

Metallic Solids

Metallic solids such as crystals of copper, aluminum, and iron are formed by metal atoms. The structure of metallic crystals is often described as a uniform distribution of atomic nuclei within a “sea” of delocalized electrons. The atoms within such a metallic solid are held together by a unique force known as metallic bonding that gives rise to many useful and varied bulk properties.
All metallic solids exhibit high thermal and electrical conductivity, metallic luster, and malleability....
18.5K
Types of Coprecipitation01:10

Types of Coprecipitation

Coprecipitation is the contamination of a precipitate by otherwise soluble species and occurs via different processes. In colloidal precipitates, coprecipitation occurs via surface adsorption. For instance, barium sulfate has a primary layer of adsorbed barium ions and a secondary layer of nitrate counterions. This results in contamination of the precipitate by barium nitrate.
Sometimes, ions in a crystal lattice can undergo isomorphous replacement by inclusions of similar charge and size. For...
670
Steel Manufacturing01:26

Steel Manufacturing

Steel manufacturing is a multi-stage process that begins by smelting iron ore into cast iron in a blast furnace. This initial stage involves layering iron ore with coke, a type of fuel, and crushed limestone within the furnace. The coke is ignited with a high volume of air, leading to the creation of carbon monoxide, which acts to reduce the iron ore to pure iron.
During this smelting process, limestone plays a crucial role by forming slag. Slag captures impurities within the molten iron, such...
636
Molecular and Ionic Solids02:54

Molecular and Ionic Solids

Crystalline solids are divided into four types: molecular, ionic, metallic, and covalent network based on the type of constituent units and their interparticle interactions.
Molecular Solids
Molecular crystalline solids, such as ice, sucrose (table sugar), and iodine, are solids that are composed of neutral molecules as their constituent units. These molecules are held together by weak intermolecular forces such as London dispersion forces, dipole-dipole interactions, or hydrogen bonds, which...
17.3K
Metal-Semiconductor Junctions01:24

Metal-Semiconductor Junctions

The contact of metal and semiconductor can lead to the formation of a junction with either Schottky or Ohmic behavior.
Schottky Barriers
Schottky barriers arise when a metal with a work function (Φm) contacts a semiconductor with a different work function (Φs). Initially, electrons transfer until the Fermi levels of the metal and semiconductor align at equilibrium. For instance, if Φm > Φs, the semiconductor Fermi level is higher than the metal's before contact. The...
395