Fixed-Diamond Abrasive Wire-Saw Cutting Force Modeling Based on Changes in Contact Arc Lengths

Area of Science:

• Materials Science
• Manufacturing Engineering
• Semiconductor Processing

Background:

• Monocrystalline silicon is crucial for semiconductors but difficult to process due to its hardness and brittleness.
• Fixed-diamond abrasive wire-saw (FAW) cutting is a preferred method for hard and brittle materials, offering advantages like minimal kerf loss and low cutting forces.

Purpose of the Study:

• To develop and validate models for contact arc length and cutting forces in FAW cutting of monocrystalline silicon wafers.
• To analyze the influence of cutting parameters on the bow angle and contact arc length during the wafer slicing process.

Main Methods:

• A model for contact arc length was established by analyzing the cutting system.
• A model for random abrasive particle distribution was developed to calculate cutting forces.
• Iterative algorithms were employed to determine cutting forces and chip surface saw marks.
• Simulations were used to investigate the relationship between bow angle, contact arc length, and cutting parameters.

Main Results:

• The simulation results showed less than 6% error in average cutting force and less than 5% error in saw arc geometry compared to experimental data.
• The study found that both bow angle and contact arc length increase with higher part feed rates.
• Conversely, bow angle and contact arc length decrease as wire velocity increases.

Conclusions:

• The developed models accurately predict the cutting forces and geometric features of FAW cutting for monocrystalline silicon.
• Understanding the relationship between cutting parameters, bow angle, and contact arc length is vital for optimizing the wafer slicing process.
• The findings contribute to more efficient and precise manufacturing of semiconductor components.