Triple-layered optical interconnecting integrated waveguide chip based on epoxy cross-linking fluorinated polymer...

Area of Science:

• Photonics and Optical Engineering
• Materials Science
• Integrated Circuit Design

Background:

• Advancements in optical interconnects are crucial for high-capacity data transmission.
• Polymer-based photonic platforms offer flexibility and cost-effectiveness.
• Developing multi-functional integrated waveguide devices is essential for next-generation optical systems.

Purpose of the Study:

• To design and fabricate a triple-layered optical interconnecting integrated waveguide chip.
• To utilize epoxy cross-linking polymer photonic platforms for device fabrication.
• To integrate arrayed waveguide grating (AWG)-based wavelength-selective switching (WSS), multi-mode interference (MMI)-cascaded channel-selective switching (CSS), and direct-coupling (DC) interlayered switching arrays.

Main Methods:

• Self-synthesis of fluorinated photopolymers (FSU-8 and AF-Z-PC EP) for core and cladding.
• Fabrication of the triple-layered optical polymer waveguide module using direct UV writing.
• Integration of 4x4 WSS, 4x4 CSS, and 3x3 DC switching arrays.

Main Results:

• Wavelength-shifting sensitivity of multilayered WSS arrays: ~0.48 nm/°C.
• Average switching time for multilayered CSS arrays: ~280 µs with <30 mW power consumption.
• Extinction ratio for interlayered switching arrays: ~15.2 dB; Transmission loss: 10.0-12.1 dB.

Conclusions:

• The fabricated triple-layered optical waveguide chip demonstrates promising performance metrics.
• The flexible multilayered photonic integrated circuits (PICs) are suitable for high-density optical interconnects.
• The device enables large-volume optical information transmission capacity for advanced communication systems.