Parameter Study on Force Curves of Assembled Electronic Components on Foils during Injection Overmolding Using...

Area of Science:

• Materials Science
• Manufacturing Engineering
• Polymer Science

Background:

• Assembled foils with printed circuit boards and electronic components are integrated into injection-molded parts.
• Electronic components risk detachment during overmolding due to high pressures and shear stresses from molten thermoplastic.
• Manufacturing process parameters critically influence the successful, damage-free integration of these components.

Purpose of the Study:

• To investigate the influence of injection molding parameters on the detachment of electronic components from assembled foils.
• To compare simulation results with experimental data for validation.
• To assess the limitations of standard mechanical testing for predicting in-process failure.

Main Methods:

• A virtual parameter study using injection molding simulation software.
• Experimental injection molding tests with 1206-sized components overmolded in polycarbonate (PC).
• Mechanical testing including shear and peel tests at room temperature.

Main Results:

• Simulated forces increased with decreasing mold thickness and melt temperature, and increasing injection speed.
• Calculated tangential forces ranged from 1.3 N to 7.3 N.
• Experimental shear forces at break (≥22 N) were higher than simulated forces, yet component detachment occurred in most experimental parts.

Conclusions:

• Standard room temperature shear tests provide limited insight into component detachment during overmolding.
• The complex loading conditions during overmolding, potentially including peel-like stresses, are not fully captured by simple shear tests.
• Further research is needed to understand and mitigate component detachment under realistic overmolding conditions.