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Capacitor With A Dielectric

Capacitor With A Dielectric

Parallel plate capacitors consist of two conducting plates separated by a certain distance. However, it is mechanically difficult to hold the large plates parallel to each other without actual contact. Hence, a dielectric layer is commonly placed between the plates, which provides an easy solution for holding the plates together with a small gap and increases the capacitance of the capacitor.
Dielectrics are non-conducting materials with no free or loosely bound electrons. When a dielectric is...

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Using Microwave and Macroscopic Samples of Dielectric Solids to Study the Photonic Properties of Disordered Photonic Bandgap Materials

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Low-Loss Dielectric Ink for Printed Radio Frequency and Microwave Devices.

Yuri Piro^1,2, Christopher Areias^3,2, Andrew Luce^3,2

¹Department of Chemistry, University of Massachusetts Lowell, Lowell, Massachusetts 01854, United States.

ACS Applied Materials & Interfaces

|July 14, 2023

Summary

Researchers developed printable dielectric materials for radio frequency (RF) applications. These materials exhibit low dielectric loss and improved mechanical properties after heat treatment, enabling multilayer RF circuits.

Keywords:

flexible electronics low-loss dielectric materialshigh-frequency device packaging printed electronics ring-opening metathesis polymerization

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Published on: December 7, 2017

Area of Science:

Materials Science
Polymer Chemistry
Electrical Engineering

Background:

Direct write printing of radio frequency (RF) components is limited by the availability of printable dielectric materials with suitable RF performance.
Existing RF laminates require high-resolution printing and specific dissipation factors crucial for advanced RF and microwave applications.

Purpose of the Study:

To develop novel dielectric materials for high-resolution direct write printing.
To achieve dielectric loss below 0.006 in the X and Ku frequency bands (8.2-18 GHz).
To ensure printability with low viscosity (<1000 cps) and a robust, low-temperature cure procedure.

Main Methods:

Ring-opening metathesis polymerization (ROMP) of 5-vinyl-2-norbornene using Grubbs catalyst (G-II) at room temperature.
Differential scanning calorimetry (DSC) to optimize catalyst activity and curing strategies.
Characterization of dielectric and mechanical properties before and after secondary heat treatment for multilayer integration.

Main Results:

Developed poly(5-vinyl-2-norbornene) with dielectric loss < 0.006 in X and Ku bands.
Achieved a 55.0% reduction in coefficient of thermal expansion (CTE) and increased glass-transition temperature (Tg) from 32.4 to 46.1 °C after secondary heat treatment.
Demonstrated successful integration into fully printed, multilayer RF applications with printed silver conductors.

Conclusions:

The developed dielectric material meets critical RF performance and printability requirements for direct write applications.
Post-printing heat treatment significantly enhances mechanical properties without compromising dielectric loss.
The material is suitable for fabricating advanced, printed multilayer RF circuits.