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Topology optimization for near-junction thermal spreading of electronics in ballistic-diffusive regime

Zheng-Lai Tang1, Yang Shen1, Han-Ling Li1

  • 1Key Laboratory of Thermal Science and Power Engineering of Education of Ministry, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China.

Iscience
|July 24, 2023
PubMed

Keywords:
Computational materials scienceElectronic materialsMaterials scienceModeling in materials scienceThermal engineering

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