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Design of a Multi-Mode Hybrid Micro-Gripper for Surface Mount Technology Component Assembly.

Gianmauro Fontana1, Nicola Iacono2, Simone Pio Negri3

  • 1Institute of Intelligent Industrial Technologies and Systems for Advanced Manufacturing CNR-STIIMA, Via A. Corti 12, 20133 Milan, Italy.

Micromachines
|July 29, 2023
PubMed
Summary

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This summary is machine-generated.

This study introduces a novel multi-mode hybrid micro-gripper for assembling diverse Surface Mount Technology (SMT) components. The device enhances manufacturing flexibility by combining vacuum and friction handling technologies for complex electronic boards.

Area of Science:

  • Robotics and Automation
  • Materials Science
  • Manufacturing Engineering

Background:

  • The rapid development of smart manufacturing and aerospace industries drives the need for advanced solutions in electronic board production.
  • Current automated Surface Mount Technology (SMT) assembly machines lack the flexibility required for small batch and pre-production of heterogeneous components.
  • Existing systems exhibit high rigidity, leading to significant set-up times and limitations in handling diverse component sizes and properties.

Purpose of the Study:

  • To design and develop an innovative multi-mode hybrid micro-gripper for versatile micro- and meso-SMT component manipulation.
  • To address the challenges of reconfigurability and flexibility in automated assembly workstations.
  • To reduce set-up times and improve the processing of a wide variety of electronic components.
Keywords:
PID controllerSMT assemblyclosed-loop control of stepper motorembedded systemhybrid micro-grippertwo-finger micro-grippervacuum micro-gripper

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Main Methods:

  • Development of a hybrid micro-gripper integrating two distinct handling principles: vacuum and friction.
  • Focus on hardware and software integration for reconfigurable and flexible device control.
  • Design considerations for accommodating components with varying dimensions and material properties.

Main Results:

  • Successful design and development of a multi-mode hybrid micro-gripper.
  • Demonstration of the micro-gripper's capability to handle a wide range of micro- and meso-SMT components.
  • Validation of the combined vacuum and friction handling approach for enhanced manipulation.

Conclusions:

  • The developed multi-mode hybrid micro-gripper offers a flexible and reconfigurable solution for SMT component assembly.
  • This innovation can significantly reduce set-up times and improve efficiency in handling heterogeneous electronic components.
  • The device represents a key advancement in automated assembly for complex electronic boards in growing industries.