Fabrication and Characterization of Three-Dimensional Microelectromechanical System Coaxial Socket Device for...

Area of Science:

• Materials Science
• Electrical Engineering
• Mechanical Engineering

Background:

• Semiconductor devices are shrinking and increasing in density, driving demand for advanced contact solutions.
• Existing solutions like spring pins and rubber sockets struggle with fine-pitch, high-speed, and high-density requirements.
• Automotive, 5G, and AI sectors require enhanced semiconductor testing capabilities.

Purpose of the Study:

• To propose a novel three-dimensional microelectromechanical system (MEMS) spring structure coaxial socket.
• To address the need for fine-pitch, high-speed, and high-density semiconductor chip package testing.
• To evaluate the performance of the proposed socket design.

Main Methods:

• A novel 3D MEMS spring structure coaxial socket was designed and fabricated.
• The design incorporates impedance matching for high-speed signal integrity.
• Mechanical tests assessed durability, and electrical tests verified performance up to 60 GHz using a vector network analyzer.

Main Results:

• The proposed socket design demonstrates promising performance for semiconductor testing.
• Mechanical and electrical tests confirmed the viability of the structure.
• The design effectively addresses fine-pitch and high-density challenges.

Conclusions:

• The novel 3D MEMS spring structure coaxial socket is a viable solution for advanced semiconductor testing.
• The design shows potential for optimization and future production.
• This innovation supports the evolving needs of high-performance electronic devices.