Hyperspectral confocal microscopy in the short-wave infrared range

Area of Science:

• Optics and Photonics
• Materials Science
• Electrical Engineering

Background:

• Laser scanning confocal microscopy (LSCM) is a powerful imaging technique.
• Short-wave infrared (SWIR) offers unique optical properties for material analysis.
• Integrated circuit (IC) inspection requires high-resolution, non-invasive methods.

Purpose of the Study:

• To demonstrate hyperspectral confocal microscopy in the SWIR range (1100-1600 nm).
• To enable high-resolution inspection and functional analysis of IC chips.
• To explore applications in inline inspection and failure analysis.

Main Methods:

• Utilized a wavelength-scanning laser coupled with LSCM.
• Acquired hyperspectral images in the SWIR range.
• Applied chemometric analysis for image interpretation.

Main Results:

• Achieved high-resolution imaging of IC chips in the SWIR range.
• Successfully identified functional circuit block groups using hyperspectral data and chemometric analysis.
• Demonstrated the potential for non-invasive analysis.

Conclusions:

• Hyperspectral confocal microscopy in the SWIR range is a viable technique for IC inspection.
• The developed instrument facilitates identification of functional circuit groups.
• This technology holds promise for inline inspection and failure analysis of ICs.