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EMI Shielding and Conductive Textiles Functionalized with (Ti,Cu) Nanomaterials for Biomedical Applications
Cláudia Lopes1,2, Armando Ferreira1,2, Marcio Correa1,2,3
1Physics Centre of Minho and Porto Universities (CF-UM-UP), University of Minho, Braga 4710-057, Portugal.
ACS Applied Materials & Interfaces
|August 1, 2023
Summary
Researchers developed new conductive textiles for electromagnetic interference (EMI) shielding using thin-film technology. Copper or titanium-copper films on cotton and lyocell knits effectively shield EMI without compromising fabric flexibility.
Area of Science:
- Materials Science
- Textile Engineering
- Electrical Engineering
Background:
- Textiles are increasingly integrated into wearable technology.
- Protection from electromagnetic radiation (EMR) is crucial for human health and device functionality.
- Existing solutions for electromagnetic interference (EMI) shielding in textiles often lack durability, flexibility, or cost-effectiveness.
Purpose of the Study:
- To investigate the integration of thin-film technology for creating novel EMI shielding and conductive textile materials.
- To functionalize cotton and lyocell textile knits with different thin films (Ti, Cu, Ti-Cu).
- To evaluate the electromagnetic interference shielding effectiveness (SE) and electrical properties of the functionalized textiles.
Main Methods:
- Fabrication of pure Ti, pure Cu, and Ti-doped Cu thin films using magnetron sputtering.
- Functionalization of cotton (39F) and lyocell (62I) textile knits with the prepared thin films.
- Characterization of thin film properties including crystalline structure, morphology, and topography.
- Evaluation of EMI shielding effectiveness (SE) in the 2-8 GHz frequency range.
- Assessment of electrical response under mechanical stress.
Main Results:
- Thin films exhibited varied crystalline structures, morphologies, and topographies based on their composition.
- Functionalized textiles demonstrated improved EMI shielding capabilities.
- Copper (Cu) and titanium-copper (Ti-Cu) thin films showed great adhesion and low thickness on textile substrates.
- The developed materials effectively shielded against EMI without significantly altering the textiles' flexibility.
Conclusions:
- Thin-film technology offers a viable method for creating advanced EMI shielding textiles.
- Cu and Ti-Cu thin films are promising for enhancing textile shielding efficiency.
- This approach provides a pathway for developing functional textiles with improved electromagnetic protection for wearables.
