Research Progress of Palladium-Plated Copper Bonding Wire in Microelectronic Packaging

Area of Science:

• Materials Science
• Electrical Engineering
• Microelectronics

Background:

• Wire bonding is the primary chip interconnection method in microelectronics.
• Metal bonding wires are critical for electronic device reliability.
• Palladium-plated copper (PdCu) wire offers a cost-effective, reliable alternative with excellent conductivity.

Purpose of the Study:

• To review the preparation methods of PdCu bonding wire.
• To analyze the application of PdCu wire, focusing on Pd distribution, intermetallic compounds, and reliability.
• To provide a comprehensive understanding and prospect future development of PdCu bonding wire.

Main Methods:

• Review of electroplating, electroless plating, and direct plating techniques for PdCu wire preparation.
• Analysis of factors influencing Pd distribution in free air balls and bonding interfaces.
• Summary of Pd's effect on intermetallic compound formation and growth in PdCu wire applications.

Main Results:

• Detailed examination of PdCu wire preparation methodologies.
• Analysis of Pd's impact on the formation and growth of intermetallic compounds.
• Evaluation of PdCu wire performance in stitch bonding and overall reliability.

Conclusions:

• PdCu bonding wire presents significant advantages in cost and performance for microelectronic packaging.
• Understanding Pd distribution and its effect on intermetallic compounds is key to optimizing reliability.
• Further research can accelerate the adoption of PdCu wire in advanced electronic applications.