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Published on: September 19, 2020
Constructing Hierarchical Polymer Nanocomposites with Strongly Enhanced Thermal Conductivity
Jianwei Zhou1, Zhongxun Yu1, Mohamedazeem M Mohideen1
1Beijing Key Laboratory of Advanced Functional Polymer Composites, College of Material Science and Engineering, Beijing University of Chemical Technology, Beijing 100029, China.
New flexible nanocomposites using polyvinyl alcohol/polydopamine-modified boron nitride nanosheets offer superior thermal conductivity and electrical insulation for advanced electronic packaging materials.
Area of Science:
- Materials Science
- Nanotechnology
- Polymer Science
Background:
- Communication technology advancements necessitate improved electronic packaging materials.
- High thermal conductivity and electrical insulation are critical for these materials.
Purpose of the Study:
- To design and synthesize polyvinyl alcohol/polydopamine-modified boron nitride nanosheet (PVA/BNNS@PDA) nanocomposites.
- To achieve enhanced thermal conductivity, electrical insulation, and flexibility for electronic packaging.
Main Methods:
- Electrospinning, vacuum filtration deposition, and hot pressing were employed.
- Hierarchical structures were created using modified boron nitride nanosheets (BNNS@PDA).
Main Results:
- Achieved ultrahigh in-plane thermal conductivity of 16.6 W/(m·K) at 35.54 wt % BNNS@PDA.
- Demonstrated excellent flexibility, with no cracks after 2000 folds.
- Exhibited a volume resistivity above 10^14 Ω·cm, meeting insulation standards.
Conclusions:
- PVA/BNNS@PDA nanocomposites offer a novel solution for thermal management materials.
- The developed method provides a new perspective for designing advanced electronic packaging materials.
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