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Related Concept Videos

Plastic Behavior01:21

Plastic Behavior

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A material's elastic behavior is characterized by the disappearance of stress once the load is removed, allowing the material to return to its original state. However, when stress surpasses the yield point, yielding commences, marking the onset of plastic deformation or permanent set. This change from elastic to plastic behavior is influenced by the peak stress value and the duration before the load is removed. An intriguing observation occurs when a specimen is loaded, unloaded, and...
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Residual Stresses01:26

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Residual stresses reside in a structure even after removing the original stress inducer. This phenomenon often arises from varied plastic deformations across different parts of a structure. Consider a rod stretched beyond its yield point. It will not regain its original length due to permanent deformation. Even after load removal, the rod does not entirely lose stress because of uneven plastic deformations, resulting in residual stresses. The computation of these stresses in structures is...
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Development of a Resilience Parameter for 3D-Printable Shape Memory Polymer Blends.

Truman J Cavender-Word1,2, David A Roberson1,2

  • 1Polymer Extrusion Lab, The University of Texas at El Paso, El Paso, TX 79968, USA.

Materials (Basel, Switzerland)
|September 9, 2023
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Summary
This summary is machine-generated.

A new resilience parameter quantifies shape memory polymer (SMP) strength retention after damage. The PLA/TPU blend demonstrated excellent resilience, while ABS/SEBS showed good resilience, and PLA/SEBS exhibited poor resilience.

Keywords:
additive manufacturingfused filament fabricationinjection moldingself-healing polymersshape memory polymers

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Area of Science:

  • Materials Science
  • Polymer Science
  • Mechanical Engineering

Background:

  • Shape memory polymers (SMPs) offer potential for self-healing and waste reduction.
  • Evaluating material resilience after damage is crucial for practical applications.
  • Additive manufacturing (AM) presents new avenues for SMP fabrication.

Purpose of the Study:

  • To establish a resilience parameter for quantifying the tensile strength retention of SMPs after damage recovery.
  • To characterize the resilience of three distinct SMP blends fabricated via fused filament fabrication (FFF) and injection molding (IM).
  • To assess the impact of deformation recovery on the mechanical properties of these SMP blends.

Main Methods:

  • Characterization of three 50/50 wt% SMP blends: PLA/SEBS-g-MA, ABS/SEBS-g-MA, and PLA/TPU.
  • Specimen fabrication using fused filament fabrication (FFF) and injection molding (IM).
  • Tensile testing to evaluate the change in tensile strength versus deformation recovery percentage.

Main Results:

  • The PLA/TPU blend exhibited excellent resilience, with injection molded samples showing increased strength upon deformation recovery.
  • The ABS/SEBS blend demonstrated good resilience, maintaining consistent strength regardless of deformation recovery.
  • The PLA/SEBS blend displayed poor resilience, with tensile strength decreasing as initial deformation increased.

Conclusions:

  • The developed resilience parameter effectively evaluates SMP performance after damage.
  • Manufacturing method influences the resilience of certain SMP blends, notably PLA/TPU.
  • Enhanced resilience in SMPs could contribute to mitigating plastic waste through improved material longevity and repairability.