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Hybrid Multimaterial 3D Printing Using Photocuring-While-Dispensing.

Jie Jin1,2, Fangzhou Zhang3, Yulong Yang4

  • 1Center for Advanced Manufacturing, University of Southern California, Los Angeles, CA, 90007, USA.

Small (Weinheim an Der Bergstrasse, Germany)
|September 9, 2023
PubMed
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This study introduces a hybrid 3D printing method combining vat photopolymerization (VPP) and direct-ink-writing (DIW) for high-resolution, multimaterial printing. The novel technique enables fabrication of complex functional structures with diverse material integration.

Area of Science:

  • Additive Manufacturing
  • Materials Science
  • Engineering

Background:

  • Vat photopolymerization (VPP) excels in high-resolution printing.
  • Direct-ink-writing (DIW) is known for its multimaterial capabilities.
  • Existing methods face limitations in combining high resolution and multimaterial printing.

Purpose of the Study:

  • To present a novel hybrid 3D printing technique.
  • To combine the strengths of VPP and DIW processes.
  • To achieve high-resolution and multimaterial printing of functional structures.

Main Methods:

  • A hybrid approach synchronizing laser-controlled photocuring with syringe-based material dispensing.
  • Utilizing a photocurable matrix and dispensing liquid-like materials.
Keywords:
composite materialsdirect ink writinghybrid printingmultimaterialstereolithography

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  • Employing a Galvano mirror-controlled laser for selective photocuring and synchronized dispensing to control diffusion and in situ fixture.

    • Main Results:

    • Successful fabrication of intricate 3D ant and wheel prototypes.
    • Demonstration of fabricating heterogeneous structures with complex geometries and high resolution.
    • Integration of diverse materials, irrespective of photocurability and viscosity.

    Conclusions:

    • The proposed photocuring-while-dispensing strategy overcomes limitations of conventional multimaterial 3D printing.
    • This hybrid method enables versatile fabrication of functional structures and devices.
    • The demonstrated process opens avenues for diverse applications requiring complex geometries and integrated functionalities.