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All silicon MIR super absorber using fractal metasurfaces
Alaa M Ali1, AbdelRahman M Ghanim2,3, Muhammad Othman1
1Department of Physics, School of Sciences and Engineering, The American University in Cairo, New Cairo, 11835, Egypt.
Scientific Reports
|September 21, 2023
Summary
Researchers developed a fractal mid-infrared (MIR) broadband absorber using doped silicon and silicon carbide. This novel design achieves high absorption enhancement, paving the way for advanced energy harvesting and plasmonic devices.
Area of Science:
- Optics and Photonics
- Materials Science
- Nanotechnology
Background:
- Perfect absorbers are crucial for applications like photodetectors and solar energy conversion.
- Mid-infrared (MIR) wavelengths offer significant advantages for various technological applications.
- Traditional metallic absorbers face limitations in certain energy harvesting scenarios.
Purpose of the Study:
- To propose and simulate a novel fractal mid-infrared (MIR) broadband absorber.
- To investigate the absorption enhancement capabilities of the proposed structure.
- To explore the use of doped silicon (D-Si) as a plasmonic material in the MIR region.
Main Methods:
- A Metal-Dielectric-Metal (MDM) structure was designed based on the Sierpinski carpet fractal.
- Doped silicon (D-Si) and silicon carbide (SiC) were used as the material layers.
- The 3D finite element method (FEM) was employed for numerical simulations using COMSOL Multiphysics.
Main Results:
- The fractal absorber demonstrated high absorption enhancement across the MIR spectrum (3-9 µm).
- Doped silicon showed superior performance over traditional metals for MIR plasmonic applications.
- The D-Si/SiC/D-Si structure achieved broadband absorption characteristics.
Conclusions:
- The proposed fractal absorber design offers significant potential for MIR applications.
- Doped silicon is a promising material for efficient energy harvesting and plasmonic devices in the mid-infrared.
- The study highlights the advantages of semiconductor materials for plasmonic devices, including CMOS compatibility and simpler fabrication.

