Sequential Laser-Burned Lignin and Hydrogen Evolution-Assisted Copper Electrodeposition to Manufacture Wearable...

Area of Science:

• Materials Science
• Electrical Engineering
• Textile Engineering

Background:

• Wearable electronics and smart textiles are transforming various industries, including healthcare and aerospace.
• A significant challenge is the direct manufacturing of electronic circuits onto fabric substrates.
• Existing methods often lack the durability or integration required for practical applications.

Purpose of the Study:

• To develop a sequential manufacturing process for creating conductive electronic circuits directly on fabrics.
• To achieve highly conductive and mechanically stable circuits suitable for wearable applications.
• To demonstrate the integration of electronic components onto fabric using the developed method.

Main Methods:

• Fabric treatment with a lignin-containing ink.
• Laser-induced carbonization of lignin to create conductive patterns.
• Localized hydrogen evolution-assisted (HEA) copper electroplating for circuit metallization.
• Material characterization using SEM, EDX, Raman, and FTIR spectroscopy.
• Mechanical stability testing including bending, rolling, stretching, washing, and adhesion.

Main Results:

• A sequential printing method successfully fabricated low-resistive circuits (0.103 Ω/cm) on fabric.
• The resulting copper nanostructures showed remarkable mechanical stability and adhesion to fabric fibers.
• The HEA method enabled successful soldering of a light-emitting diode to the fabric circuit.
• Material analysis confirmed the nanostructure and composition of the printed layers.

Conclusions:

• The developed sequential printing method offers a viable approach for fabricating reliable wearable electronics on textiles.
• The process demonstrates potential for applications in medical monitoring and other advanced fields.
• The combination of laser patterning and HEA electroplating provides a robust platform for integrated electronic textiles.